Open access
Sep 2026
Line–Plane Thermally Conductive Networks in MWCNTs/Ti3C2Tx-Modified PVA Films: Construction and Effects on Film Properties
Thermal interface materials used in high-power electronic devices must combine efficient heat transfer with mechanical flexibility and suitable thermal stability. However, constructing continuous in-plane and through-plane heat-conduction pathways at low filler loadings while preserving mechanical properties remains ch...
Guo-Jun Cheng, Ming Yan, Ya-Ling Zhang et al.
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