Oct 2026
Nano-Al 2 O 3 surface modification and thermal-dielectric properties of epoxy composites
With the rapid development of microelectronics, high-performance epoxy packaging materials are in great demand. Herein, nano-Al 2 O 3 (20 and 200 nm) was surface-modified by KH560 and incorporated into epoxy resin (EP) to fabricate Al 2 O 3 /EP composites. The effects of filler size, surface modification and...
Jia Yuan, Mei Liu, Ju-Xiang Yang et al.
· Plastics, Rubber and Composi... · 0 citations