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Review Open access Aug 2026

Sidewall Patterning in 3D Micro/Nanosystems: A Review

Current micro/nanosystems mainly rely on a planar fabrication framework, where structures are built layer-by-layer on flat surfaces. This conventional approach leaves vertical sidewalls underutilized, posing geometric limits in packaging density, three-dimensional (3D) interconnects, and multi-surface functionalization...

Xin-Chuan Liu, C. Luo · 0 citations

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