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Chong-Gui Zhong

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Open access Oct 2026

Synergistically Enhanced Properties of Polyimide Films via In-Situ Hollow SiO2 Nanospheres

Polyimide (PI) films serving as high-temperature dielectric and structural materials are increasingly required to combine mechanical robustness, thermal stability, and low dielectric properties for advanced electronic packaging. Herein, PI composite films incorporated with 110 nm hollow SiO2 nanospheres were fabricated...

Zheng Wu, Rui Meng, Chong-Gui Zhong et al. · 0 citations

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