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Author

Christian D. Nielsen

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Oct 2026

Wide-Field Quantum Diamond Magnetic Microscopy at Nanotesla Sensitivity for Non-Destructive Semiconductor Failure Analysis

Failure analysis (FA) of advanced semiconductor packages is increasingly constrained by the inability of established techniques to image faults buried inside 2.5D and 3D integrated devices. Magnetic current imaging offers a non-destructive route to localising buried currents through opaque packaging, but no existing...

Samuel Mondberg, Luis D. Bonavena, T. K. Pfau et al. · 0 citations

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