Chun-Hsien Lee

AI-Based Image Enhancement Improves Detection of Interconnect Defects in Microelectronic Packaging

Traditional failure-analysis (FA) methods face growing challenges due to the increasing miniaturization and complexity of modern semiconductor devices. In particular, the detection of cracks in the extreme low K layers of flip-chips, utilized in advanced packaging architectures at the back end of line (BEOL), is chal...