Sep 2026
Thermo-mechanical coupled separation of high-value BGA components from waste mobile-phone printed circuit boards.
Discarded smartphone printed circuit boards (PCBs) contain high-value CPU and ROM components with reuse potential. This study investigated a thermally assisted separation strategy integrating thermal-process evaluation, mechanical analysis, and VOC characterization. A purposive set of 20 used smartphone models was exam...
Jing-Fu Xu, Cheng-Long Zhang, Qi-Yu Duan et al.
· Waste Management · 0 citations