Jul 2026
Wafer-Scale MOCVD Integration of 2D Materials for CMOS Applications and Beyond
The growing computational demands of edge computing and AI applications are pushing semiconductor technologies to their physical and architectural limits, particularly in power efficiency and memory integration. Two-dimensional (2D) layered materials, with their unique (opto)electronic and mechanical properties, allow...
Emre Yengel, C. Mauder, S. Pasko et al.
· ECS Meeting Abstracts · 0 citations