Oct 2026
Mechanistic study on the influence of semi-solid processing on the interfacial bonding performance of copper-steel bimetallic composites
Copper-steel bimetallic composites combine the high thermal and electrical conductivity of copper with the strength and wear resistance of steel, yet their performance and service life remain constrained by interfacial bonding quality. Although semi-solid processing offers a promising route to interface optimization, i...
Xiao-Liang Fang, Yan-Guo Yin, Zhang-Quan Zhou et al.
· Physica Scripta · 0 citations