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2026

Two Stages Machine Learning-Based Design Optimization for Electromigration Reliability in Solder Joints

For high-performance electronic components to function well and last a long time, trustworthy solder joint design is essential, particularly in situations with high current densities that cause electromigration (EM). Variations in solder joint shape, such as width, height, and radius, lead to uneven current densities a...

Hao Wu, Zhi-Gang Tian, Ming J. Zuo · 0 citations

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