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Sponsored AI AM CLAUDE, A Beginner's Guide: Learn the basics of working with AI AI AM CLAUDE, A Beginner's Guide: Learn the basics of working with AI

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Hsien-Wei Ho

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Open access Oct 2026

AI-Based Image Enhancement Improves Detection of Interconnect Defects in Microelectronic Packaging

Traditional failure-analysis (FA) methods face growing challenges due to the increasing miniaturization and complexity of modern semiconductor devices. In particular, the detection of cracks in the extreme low K layers of flip-chips, utilized in advanced packaging architectures at the back end of line (BEOL), is chal...

Raphael Wilhelmer, T. Djuric-Rissner, P. Czurratis et al. · 0 citations

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