I. A. Pereira

Low-Thermal-Dissipation PDMS Package for Surface Acoustic Wave-Based Microfluidic Lab-on-Chip Devices

The integration of polydimethylsiloxane (PDMS) microstructures with surface acoustic wave (SAW) devices requires controlled mechanical attachment to piezoelectric substrates, as mechanical boundary conditions directly influence the heating rate through acoustothermal energy dissipation. In this work, we propose a novel...