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J. Tien

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Open access Aug 2026

Connecting Creep Constitutive Parameters to Microstructural Deformation in Sn

The deformation behavior of solders based on β-Sn is influenced by a high homologous operating temperature and microstructural heterogeneity. In this study, the deformation mechanisms of single-crystal and polycrystalline Sn were investigated using high-temperature nanoindentation combined with post-indentation microsc...

J. Tien, D. Bahr · JOM · 0 citations