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Sponsored AI Networking Cookbook: Practical recipes for AI-assisted network automation and development AI Networking Cookbook: Practical recipes for AI-assisted network automation and development

Author

Jaeho Seo

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Review Sep 2026

Multidimensional Heat‐Path Engineering in Thermal Interface Materials for High‐Performance Electronics

The rapid expansion of artificial intelligence, high‐performance computing, and chiplet‐based electronic platforms is intensifying package‐level thermal bottlenecks by increasing power density and hotspot severity. Polymer‐composite thermal interface materials (TIMs) offer scalable fabrication and cost‐effective manu...

Jin-Gyu Na, Jaeho Seo, Sung-Woo Yang et al. · 0 citations

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