Jing-Bing Yang

Low-Modulus Thermal Interface Materials with Bicontinuous Heat-Conduction Pathways Enabled by Liquid Metal and Graphene Films

Developing thermal interface materials (TIMs) with high thermal conductivity (k) and good mechanical compliance is critical for thermal management of high-power electronics. However, conventional polymer-based TIMs usually suffer from low intrinsic k, while the incorporation of highly conductive fillers often leads t...