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Author

Jing-Fu Xu

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Sep 2026

Thermo-mechanical coupled separation of high-value BGA components from waste mobile-phone printed circuit boards.

Discarded smartphone printed circuit boards (PCBs) contain high-value CPU and ROM components with reuse potential. This study investigated a thermally assisted separation strategy integrating thermal-process evaluation, mechanical analysis, and VOC characterization. A purposive set of 20 used smartphone models was exam...

Jing-Fu Xu, Cheng-Long Zhang, Qi-Yu Duan et al. · 0 citations

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