Jun Wang

Effect of the Mass Transfer Biot Number on Moisture Desorption and Hygrothermal Stress in QFN Packages

Package-level hygrothermal simulations commonly represent drying at epoxy molding compound (EMC) surfaces using idealized boundary conditions, which may not fully capture the coupled effects of bulk moisture diffusion and surface evaporation during reflow soldering and thermal cycling. This study developed a diffusion-...