From Molecular Design to Applications: A Comprehensive Review on Modifying Bismaleimide-Triazine Resin Substrates for Advanced Electronic Packaging and Communications
Bismaleimide-Triazine (BT) resins are high-performance thermosetting polymers characterized by interpenetrating polymer networks (IPNs) or co-reacted network structures. As core dielectric materials, they combine low dielectric constant (Dk), low dissipation factor (Df), and good thermal stability (Tg > 250 °C), supp...