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Author

M. Z. Abdullah

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Conference Aug 2026

Machine Learning-Assisted Optimization of Transfer Molding Parameters for Wire Sweep Reduction in PBGA and Advanced IC Packaging

Wire sweep remains a critical reliability concern in plastic ball grid array (PBGA) and advanced wire-bonded integrated circuit packages because excessive bond-wire deformation during transfer molding can lead to short circuits, open circuits, and long-term electrical degradation. This study develops and evaluates a ma...

D. Ramdan, M. Z. Abdullah, S. Rahman et al. · 0 citations

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