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Author

S. Graham

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Open access Sep 2026

Electro-Thermal Scaling Limits in Ultra-High-Density SiC Power Modules

Aggressive power-density targets for next-generation SiC traction inverters are driving highly integrated bare-die power modules in which losses are concentrated over extremely small footprints. Conventional copper heat spreaders, commonly employed to mitigate localized hotspots, introduce additional electrical parasit...

Ayodhya Somiruwan Gamwari, Alexander Lyons, S. Graham et al. · 0 citations
Oct 2026

Electromechanical Reliability of Integrated Air-Bridge Anodes for Vacuum Microelectronic Devices

Vacuum field-effect diodes (VFEDs) offer significant advantages in high-frequency and harsh-environment applications due to their superior radiation hardness and robustness when operating under high temperatures. In this study, electromechanical effects and packaging considerations of air-bridge-style VFEDs with integr...

Vivek V. Manepalli, G. Doundoulakis, Damena D. Agonafer et al. · 0 citations

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