Modeling and Experimental Study of Cross-Electromechanical Admittance for Crack Localization in Beams with Distributed Piezoelectric Wafers
This research developed a novel crack localization technique that employed cross-electromechanical admittance (EMA), and its validity was verified through both analytical simulations and experimental measurements. Initially, an analytical model of the cross-EMA was established based on the transfer matrix method (TMM),...