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Sponsored Design Multi-Agent AI Systems Using MCP and A2A: Engineer your own Pyt Design Multi-Agent AI Systems Using MCP and A2A: Engineer your own Pyt

Author

Wonjin Lee

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Review Sep 2026

Multidimensional Heat‐Path Engineering in Thermal Interface Materials for High‐Performance Electronics

The rapid expansion of artificial intelligence, high‐performance computing, and chiplet‐based electronic platforms is intensifying package‐level thermal bottlenecks by increasing power density and hotspot severity. Polymer‐composite thermal interface materials (TIMs) offer scalable fabrication and cost‐effective manu...

Jin-Gyu Na, Jaeho Seo, Sung-Woo Yang et al. · 0 citations

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