Y. Ding

Studie van de impact van thermische gradiënten op de betrouwbaarheid van metalen gebruikt in de micro-elektronica

The continuous scaling of microelectronic technologies has made back-end-of-line (BEOL) interconnect reliability increasingly sensitive to non-uniform thermal conditions. Reduced interconnect dimensions, high current densities, Joule heating, and nearby heat sources can generate pronounced temperature gradients along m...