Zhang-Hong Wang

A Physics-Guided Gradient Boosting Approach for Few-Shot Prediction of Plastic Work Density in BGA Solder Joints

With the increasing power density in advanced packaging, the thermo-mechanical reliability of Ball Grid Array (BGA) solder joints has become a critical concern. While data-driven machine learning models are applied for fatigue prediction, they typically suffer from severe overfitting and violate physical laws under dat...