Aug 2026· Materials· Vol 19, pp. 3721· 0 citations· 37 references
Medicine
Abstract
The atomic-scale mechanism of the titanium-induced frictional removal of 3C-SiC remains insufficiently understood, particularly regarding the role of interfacial chemical interactions in material removal. In this study, molecular dynamics (MD) simulations were performed to systematically investigate the interfacial reactions, atomic migration, and structural evolution during titanium friction on SiC surfaces. The results demonstrate that Ti atoms diffuse into the SiC lattice, while Si and C atoms migrate toward the Ti layer, leading to the formation and evolution of Ti–Si and Ti–C bonds at the friction interface. These tribochemical interactions disrupt the stable Si–C bonding network, promote atomic rearrangement, and accelerate lattice amorphization, thereby facilitating friction-induced material removal. Compared with the Si-terminated surface, the C-terminated surface exhibits stronger Ti–C chemical affinity, resulting in enhanced interfacial diffusion, more severe amorphization, and pronounced graphitization. Moreover, increasing the indentation depth mainly enhances mechanical deformation, whereas higher sliding velocity and temperature promote atomic activation and interfacial chemical reactions. This work reveals the synergistic mechanism of tribochemical bonding and structural transformation during titanium-assisted SiC removal, providing fundamental insights and theoretical guidance for the development of high-efficiency and low-damage ultra-precision machining technologies for SiC.
Understanding the relationship between structural degradation and atomic diffusion is essential for elucidating coating failure at solid interfaces. However, the atomic-scale connection between wear and diffusion remains unclear under coupled thermo-mechanical conditions. In this work, molecular dynamics (MD) simulatio...
Zunyan Ma, C. Yue, Zhi-Peng Jiang et al.· Langmuir· 0 citations
Due to its strong Si–C covalent bonds, high hardness, and strong chemical inertness, single-crystal SiC still faces challenges in chemical mechanical polishing (CMP), including low material removal rates, difficulty in controlling surface and subsurface damage, and an unclear understanding of the chemical–mechanical...
Shi Chen, Jia-Yun Deng, Jun Zhou et al.· Langmuir· 0 citations
Understanding the interfacial oxidation behavior during chemical–mechanical polishing (CMP) of diamond is important for controlling surface chemical modification and subsequent material removal. In this study, reactive force field molecular dynamics (ReaxFF MD) simulations were employed to comparatively investigate the...
Ke-Chong Wang, Yun-Kai Wang, Meng Li et al.· Micromachines· 0 citations
The tribological performance of MXene/MoS2 heterostructure-based polymer coatings is limited by an incomplete understanding of electronic/atomic interfacial evolution, as well as an insufficient adaptive response to dynamic contact stress under friction conditions, which restricts the realization of load-bearing capaci...
Chuan Tang, Chang-You Wang, Bo Ling et al.· ACS Applied Materials and In...· 0 citations
Zirconium and its alloys are widely used in nuclear applications due to their low neutron absorption, corrosion resistance, and favorable mechanical properties. However, hydrogen uptake and irradiation-induced defects (vacancies and self-interstitial atoms (SIAs)) can significantly degrade performance. In this work, mo...
A. Alivaliollahi, H. Nemati, Gh. Alahyarizadeh· Discover Mechanical Engineer...· 0 citations
This work presents a comparative study of heterojunctions based on 6-inch wafers between silicon carbide and silicon (including Si-face of 4H-SiC and Si, and C-face of 4H-SiC and Si) fabricated via low temperature surface-activated bonding performed on the EVG ComBond system. We systematically investigate crystallogr...