Skip to content
Open access

Physics-Informed Machine Learning for Smarter Design and Manufacturing Part I

Aug 2026 · Journal of Computing and Information Science in Engineering · 0 citations

TL;DR

Ten contributions are brought together to demonstrate how the systematic integration of physical knowledge can enhance model robustness, reduce data requirements, and improve generalization across manufacturing applications.

Abstract

Manufacturing systems are undergoing a fundamental transformation driven by the convergence of cyber-physical infrastructure, ubiquitous sensing, and artificial intelligence. At the heart of this transformation lies the challenge of embedding physical knowledge into data-driven models to achieve both predictive accuracy and engineering interpretability. Physics-informed machine learning (PIML) has emerged as a paradigm for integrating conservation laws, constitutive equations, and domain constraints into neural architectures. Despite significant advances in smart design and manufacturing, three persistent gaps remain. First, multimodal sensor fusion in manufacturing environments continues to struggle with heterogeneous data types and varying sampling rates, where data-driven approaches often fail to generalize across operating conditions. Second, intelligent fault diagnosis under data scarcity, label noise, and cross-domain shifts demands methods that can encode physical priors while maintaining sample efficiency. Third, dynamic production planning under disturbances requires optimization frameworks that respect physical constraints while adapting in real time. This special issue brings together 10 contributions that address these challenges through novel PIML models. These works demonstrate how the systematic integration of physical knowledge can enhance model robustness, reduce data requirements, and improve generalization across manufacturing applications.

Read PDF

Similar papers

Review Open access Aug 2026

Integrated Machine Learning and Smart Infrastructure Frameworks for Advanced Additive and Hybrid Manufacturing Systems

The integrated architectural approach is able to link manufacturing at the physical level with the sensing, data infrastructure, physics-based modelling, surrogate modelling, artificial intelligence, and closed-loop control levels, and puts the emphasis on the remaining need for physics-based knowledge, transparent dec...

Md Rehan Uddin, Sumi Ghosh · 0 citations
Review Open access Jul 2026

Impact of Artificial Intelligence and Machine Learning on Applications and Simulation Tools of Mechanical Engineering: A Comprehensive Review

This review synthesises the state of the art across five interconnected domains: structural simulation and finite element analysis, computational fluid dynamics, design automation and topology optimisation, manufacturing process simulation with particular attention to additive manufacturing, and prognostics together wi...

Vaishali A. Kherdekar, Shravani Kherdekar · 0 citations
Open access 2020

Data-Centric Engineering: Integrating Simulation, Machine Learning, and Statistics

This article delves deep into the confluence of simulation, ML, and statistics, showcasing how they synergize to improve engineering workflows and emphasizes that DCE is not just a technological advancement but a foundational strategy for next-generation engineering solutions.

Benjamin Scott · 0 citations
Conference Open access Jul 2026

Physics-informed few-shot data augmentation technology for industrial predictive maintenance

This approach provides robust, physically-grounded data to effectively support the training of deep learning-based Remaining Useful Life (RUL) prediction models under few-shot constraints.

Shikai Lu, Shuangfeng Wu, Changmin Chen · 0 citations
Open access Aug 2026

Multi-objective and cross-scale inverse design of temperature-control materials via physics-constrained machine learning

An artificial intelligence framework that incorporates a physics-constrained inverse-design system (PHICS) built upon a directed acyclic graph (DAG) architecture for CPCMs, integrating interface, phase, and carrier engineering.

Dong-Liang Ding, Min-Hao Zou, Ruo-Yu Huang et al. · 0 citations

We use cookies to run the site and, with your consent, for analytics and to show ads. See our Cookie Policy.