Summary Nanocomposite engineering offers a route to improve thermoelectric (TE) performance by modifying the coupled transport of charge carriers and phonons. This review examines carbon- and boron-based nanoinclusions across bismuth chalcogenides, Cu2Se, oxide matrices, and flexible polymer- and film-based thermoelectrics, with emphasis on inclusion chemistry, dimensionality, loading, processing route, and interface engineering. Bismuth chalcogenides generally require a narrow loading window because additional interfaces can degrade carrier mobility, whereas Cu2Se more readily accommodates such interfaces and has high zT values > 2. In oxides, improved electrical transport is often insufficient to offset high lattice thermal conductivity, while flexible systems require consideration of power factor, mechanical durability, and device output. Cross-system comparison shows that effective nanoinclusion design depends on balancing phonon suppression with carrier transport and interfacial stability, providing practical guidance for thermoelectric materials and device development.
Summary Thermoelectric thin films based on bismuth telluride (Bi2Te3) are widely used for room temperature energy harvesting, but improving electrical, thermal, and mechanical properties simultaneously remains challenging. In this study, Bi2Te3-carbon black nanoparticle nanocomposite films were synthesized by electrode...
K. F. Samat, M. A. Alias, Muhammad Aliff Ikhwan Che Azman et al.· iScience· 0 citations
This review provides an overview of recent advances in metallic and intermetallic alloys, which have emerged as promising alternatives to traditional semiconductor thermoelectrics for power generation and active solid-state cooling. Driven by the abundance, low toxicity, mechanical robustness, and manufacturability of...
O. Caballero-Calero, Cristina V. Manzano, M. Martín-González· APL Energy· 0 citations
Advanced thermal management increasingly requires materials capable of not only dissipating heat but also regulating, converting, and storing thermal energy. Graphitic carbon nitride (g-C3N4), a two-dimensional polymeric semiconductor, has emerged as a promising platform for next-generation thermal management materials...
Xin Liu, Hong-Rui Wang-Zhao, Yu-Long Tuo et al.· ChemSusChem· 0 citations
Boron nitride nanosheets (BNNSs) combine high intrinsic thermal conductivity, electrical insulation, and chemical stability, making them attractive electrically insulating fillers for electronic thermal management applications. However, the random dispersion of BNNSs within polymer matrices severely restricts the effec...
Xiao-Yang Wang, Yue Lv, Tao Yang et al.· Energy Use· 0 citations
With the rapid evolution of high-power electronics driven by advanced communication technologies and artificial intelligence, efficient thermal management has become a critical challenge. Hexagonal boron nitride (h-BN)/polymer composites, which integrate the flexibility of polymers with high thermal conductivity, low d...
Yao-Hui Zhang, Ting-Ting Miao, Ze-Xu Wang et al.· ACS Applied Materials and In...· 0 citations
Thermoelectric (TE) materials convert thermal gradients into electrical energy, offering asolid-state route to sustainable power generation and precision cooling. Among these, Bi2Te3-based thin films including alloys such as Bi2Te3-xSex and BixSb2-xTe3 are key candidates for microenergy systems due to their reduced dim...
Samira Saddique, I. Ullah, Muhammad Irfan et al.· The chemical record· 0 citations
We use cookies to run the site and, with your consent, for analytics and to show ads.
See our Cookie Policy.
