Numerical Optimization of a Developed Multi-Baffle Heat Sink for Modern Electronic Devices

Abstract

Optimal thermal control is crucial for ensuring the efficiency and stability of modern electronic devices. This paper analyzes four multi-barrier heat sink models using computational fluid dynamics (CFD) to optimize heat removal from a hot surface under constant convection. We analyzed the models under laminar flow conditions in ANSYS Fluent, using five inlet velocities in a low-Reynolds-number range. We used the heat transfer coefficient and Nusselt number as key performance indicators. The numerical results showed that adding inclined barriers improves coolant distribution and enhances fluid mixing within the flow channels, thereby increasing the localized convection heat transfer rate. Among the designs studied, configuration four model (M4) exhibited the highest thermal performance, achieving the greatest increase in both the heat transfer coefficient  and the Nusselt number, 9.06. The improvement is more pronounced at higher Reynolds numbers, demonstrating the positive effect of flow direction on convection heat transfer. Overall, the proposed multi-barrier design provides an efficient way to improve passive cooling without additional power consumption or system complexity, making it a promising approach for integrated electronics cooling applications. This study provides useful design indicators for developing heat sinks used in modern electronic devices.