Preface

Abstract

The 6th International Conference on Advanced Materials and Mechatronics (ICAMM 2026) convened in Dalian, China, from May 15 to 17, 2026, at a time when materials innovation and intelligent mechanical systems are increasingly converging into a unified research frontier. Rather than treating materials science and mechatronics as separate domains, the conference was designed to foreground their deep interdependence—particularly how material functionalities, sensing mechanisms, and computational intelligence collectively shape next-generation engineering systems. The technical program was structured around a sequence of keynote lectures and oral presentations that collectively reflected this convergence. Prof. Jinhui Song introduced advances in meta-dynamic range image sensor design, highlighting how novel sensing architectures expand the boundaries of optical perception and device-level integration. Prof. Fengming Du presented an intelligent algorithmic framework for predicting bearing material wear, emphasizing the shift from empirical material evaluation toward data-driven predictive modeling. Prof. Changzheng Chen addressed the challenges of intelligent fault diagnosis and operational maintenance for large-scale wind turbine components, where structural complexity and harsh environments demand increasingly autonomous diagnostic strategies. Prof. Shahid Hussain discussed interfacial charge modulation in Bi-based heterostructures for ppb-level detection, illustrating how nanoscale interface engineering can enable extreme sensitivity in functional devices. In addition to these keynote contributions, the oral presentation sessions provided a broader spectrum of emerging studies, enabling direct academic exchange on ongoing experimental and theoretical work. Across the conference, contributions spanned a wide but interconnected set of themes, including mechanical behavior and failure mechanisms of materials, semiconductor and electronic materials, optical and magnetic systems, micro- and nanostructured materials, metamaterials and quantum materials, multifunctional and adaptive materials, energy storage and conversion systems, surface engineering and thin-film technologies, as well as computational materials science and materials genome approaches. On the mechatronics and systems side, discussions extended to sensor integration, MEMS technologies, intelligent mechanical design, and system-level engineering of complex devices. A recurring emphasis throughout the program was the coupling of material-level innovation with system-level intelligence, particularly in sensing, diagnostics, and adaptive control. List of Committee Member is available in this PDF.