Future directions for diamond-like carbon in microsystems and microdevices

Abstract

Diamond-like carbon (DLC) films have emerged as key materials for enhancing the performance, reliability, and durability of microsystems and microdevices. This perspective article presents an analysis of the scientific and technological evolution of DLC from a conventional protective coating to a multifunctional platform material for microsystems and microdevices. Recent advances in tailoring the mechanical, electrical, chemical, and surface properties of DLC have been discussed, highlighting its potential to mitigate friction, adhesion, and wear in microelectromechanical systems (MEMS), while enabling new functionalities in microsensors, biomedical devices, and microelectronic platforms. Despite significant progress, several challenges continue to hinder broader technological adoption, including residual stress management, low-temperature deposition compatible with complementary metal–oxide–semiconductor (CMOS) processes, large-area scalability, and long-term reliability under demanding operating conditions. Future developments are expected to rely on engineered DLC architectures, such as doped, multilayer, and nanostructured films, combined with advanced surface functionalization and intelligent process optimization to meet application-specific requirements. Furthermore, the need for standardized integration strategies that bridge the gap between laboratory-scale research and industrial manufacturing is emphasized.