Bridging Printing and Lithography: A Hybrid Pathway toward Nanoscale Additive Manufacturing of Electronics

Abstract

Additive manufacturing of electronics has transitioned from laboratory demonstrations to practical applications, but its ability to pattern features in nanometer scale remains a critical limitation. Current printing techniques are constrained by droplet formation, spreading dynamics, substrate interaction and nozzle diameter, which limits their integration into high-density electronic systems. Meanwhile, growing demand for flexible, wearable, stretchable and low-cost electronics requires scalable, low-waste manufacturing compatible with diverse substrates. In this perspective, we examine the commonly used printing techniques and process limitations that govern resolution. We then discuss a recently demonstrated proof-of concept hybrid pathway that combines lithographic patterning with plasma-jet printing to achieve high-resolution features. Plasma-jet printing is highlighted as a promising approach because plasma-assisted printing can reduce the high-temperature post-processing while improving film adhesion and conductivity and can enable in-situ surface activation and reactions. The advantages of this process are discussed in detail and key challenges related to the scalability, print uniformity, and integration with existing manufacturing methods are highlighted.