Dynamic polymer networks (DPNs), constructed via reversible covalent bonds or non-covalent interactions, have emerged as a versatile material platform that uniquely combines stimuli-responsive adaptability, reprocessability, and recyclability with the mechanical robustness of thermosets. These attributes have recently become particularly attractive for thermal management applications, where conventional static materials often suffer from single functionality, poor interfacial adaptability, and end-of-life non-recyclability. This perspective provides a systematic overview of recent advances in DPN-based thermal management materials, organized around three technological pathways: switchable thermal conductivity materials, adaptive thermal interface materials, and dynamic radiative cooling materials. We discuss how reversible bond exchange enables molecular-level regulation of chain conformation, filler network architecture, and interfacial conformability, thereby achieving on-demand control of heat transport, reduction of contact thermal resistance, and dynamic modulation of radiative cooling performance. The intrinsic recyclability of DPNs further allows material repair, reshaping, and component recovery, supporting circular economy principles. Finally, we identify key challenges-including the trade-off between dynamicity and long-term stability, response speed, multifunctional integration, and scalable manufacturing-and offer perspectives on future directions toward intelligent, sustainable, and high-performance thermal management systems.
Elastomers with dynamic covalent networks (DCNs) often undergo progressive mechanical degradation after thermal reprocessing mainly due to incidental backbone cleavage and chemical oxidation, whereas their chemical recycling typically relies on harsh conditions. Herein, we report a mechanically robust, dual-mode recy...
Advanced thermal management increasingly requires materials capable of not only dissipating heat but also regulating, converting, and storing thermal energy. Graphitic carbon nitride (g-C3N4), a two-dimensional polymeric semiconductor, has emerged as a promising platform for next-generation thermal management materials...
Xin Liu, Hong-Rui Wang-Zhao, Yu-Long Tuo et al.· ChemSusChem· 0 citations
With the rapid evolution of modern electronics, energy storage, and semiconductor industries, the demand for high-performance adhesives has shifted from a sole focus on adhesion strength to multifunctionality and sustainability. Conventional thermosetting adhesives are limited by their irreversible covalent networks an...
Fanxuan Zeng, Jiang Wu, Zhi Dong et al.· Chemical Science· 0 citations
Elastomeric materials are used where few other polymeric materials can operate: in components that must deform repeatedly, recover rapidly, and continue to bear load under mechanical or environmental stress. Yet the molecular features that give elastomeric materials high performance often work against sustainability. T...
Nan Sun, Kaiqiang Zhang, Xu Wang· Accounts of Chemical Researc...· 0 citations
Ice accretion on outdoor infrastructure can severely compromise operational safety and service reliability, creating a strong demand for energy-efficient deicing materials. Conventional photothermal polymers, however, often suffer from an inherent trade-off between mechanical robustness and functional performance, an...
Yang Wang, Jing-Ru Wang, Le Guo et al.· ACS Applied Polymer Material...· 0 citations
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