Understanding the mechanical behavior of bimetallic nanoparticles under compressive stress is relevant for the use of these nanostructures in catalysis and nanomechanics. In this work, we present molecular dynamics (MD) simulations of compressive deformation in Pt–Ni nanoparticles—and bulk systems for comparison—with varying compositions (PtxNi1−x) and local distributions. The simulations show that the mechanical response is governed by local strain fields, which influence both elastic and plastic regimes. The final trajectories were analyzed by dislocation analysis (DXA), simulated STEM imaging, and geometric phase analysis (GPA), which allowed the obtention of high-resolution strain maps. Analysis of von Mises stress distribution allowed us to correlate composition and atomic ordering with the formation and evolution of dislocations in the nanoparticles. The Pt0.5Ni0.5 intermetallic compound exhibits superior mechanical performance under uniaxial compression; in bulk, this composition also shows enhanced elastic energy storage. In polycrystalline nanoparticles, energy dissipation increased with decreasing average grain size, which is attributed to elevated plastic activity induced by the presence of multiple crystallographic orientations. GPA results show that it is possible to discriminate between compositions differing by as little as Δx = 0.1 based on local strain distributions, and the comparison with GPA performed on real STEM micrographs gives a fair agreement. GPA and atomistic stress maps reveal how strain fields evolve during compression and how they correlate with the development of plasticity. These findings highlight the critical role of local structural heterogeneities in dictating the mechanical behavior of nanoscale Pt–Ni systems, and provide strong evidence that GPA can correlate local strain and composition in real high-resolution micrographs.
To investigate the mechanical response and atomic-scale deformation mechanisms of gradient nanostructured FeMnCoCrNi high-entropy alloys under nanoindentation, molecular dynamics simulations were utilized to systematically explore the synergistic regulatory effects of indentation direction, gradient rate, temperature,...
Nanoscale structures have drawn significant attention due to their unique and interesting properties. At nano size, surface stress and crystal orientation are the key factors in defining the properties. In this context, mechanical properties of an aluminium nanowire, subjected to uniaxial tensile loading have been inve...
S. Barik, Bedamati Majhi, S. S. Sarangi· Journal of Metastable and Na...· 0 citations
4H-SiC substrate is widely employed in semiconductor device fabrication owing to its unique crystal structure and excellent physicochemical properties. However, its deformation behavior during substrate processing remains complex and not fully understood. In this study, molecular dynamics (MD) simulations were performe...
Wuqing Lin, Hongyang Li, Zhongwei Hu et al.· Materials· 0 citations
Cu/Al laminated composites are promising for lightweight conductive and thermal-management applications, but tensile reliability is strongly affected by deformation incompatibility and damage localization near heterogeneous interfaces. Molecular dynamics simulations were performed to reveal the void-dominated fracture...
Wei Feng, Xiaowei Wang, Weiqiang Wan et al.· Engineering Research Express· 0 citations
The deformation behavior of solders based on β-Sn is influenced by a high homologous operating temperature and microstructural heterogeneity. In this study, the deformation mechanisms of single-crystal and polycrystalline Sn were investigated using high-temperature nanoindentation combined with post-indentation microsc...
This work employs molecular dynamics simulations to explore how different embedded inclusions (Al, Co, Cr, Fe, and Ni) affect the tensile response and deformation mechanisms of single-crystal Al0.3CoCrFeNi high-entropy alloys. The findings show that inclusion composition has a significant impact on mechanical performan...
Thi-Nhai Vu, Van-Trung Pham, T. Nguyen et al.· 2026 11th International Conf...· 0 citations
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