Transient Scheduling of Dual-Armed Cluster Tools with Concurrent Processing for Enhancing Fab-Level Resilience

Abstract

With the rapid evolution of global semiconductor supply chains, maintaining efficient and stable fab-level operations is critical to manufacturing performance. As core processing platforms in advanced wafer fabrication, cluster tools face increasing scheduling complexity under high-mix, lowvolume production. This study addresses the transient scheduling problem of dual-armed cluster tools processing two wafer types concurrently with explicit consideration of wafer residency time constraints (WRTCs). A mixed-integer programming (MIP) model is developed to optimize wafer release order and robot task sequence with the objective of minimizing total completion time. Numerical results show that dual-armed cluster tools consistently outperform single-armed configurations. Overall, the proposed approach provides a practical solution for enhancing operational efficiency and strengthening the operational resilience of dual-armed cluster tool scheduling under transient production conditions.