Skip to content
Open access

Synergistic Interfacial Engineering via In Situ Covalent Bonding for High-Temperature Polymer Dielectric Energy Storage.

Oct 2026 · Small · 0 citations · 60 references
Medicine

Abstract

Polymer dielectrics for high-temperature capacitors are critically limited by thermally induced charge transport and breakdown. Herein, we introduce synthesized novel Au coated with Si-O-Si network (SONET) nanoparticles into a polyetherimide (PEI) matrix. The design leverages synergistic interfacial barrier effects-Coulomb blockade effect from the Au nanoparticle core and charge-blocking effect from the wide-bandgap SONET shell-while in situ covalent bonding (Au─S and C─O─Si) ensures robust interfaces and eliminates severe agglomeration. Furthermore, tailoring the particle size distribution modulates the Young's modulus and rigid amorphous fraction (RAF) formation, enabling a bimodal size distribution that maximizes the trapping efficiency. Thus, the composite achieves an outstanding Ud of 4.14 J cm-3 with η of 90% and a maximum Ud of 5.07 J cm-3 at 200°C alongside the improved Eb of 604 MV m-1. This work offers a generalizable paradigm for covalently engineered polymer nanocomposites toward high-performance capacitive energy storage at extreme temperatures.

Read PDF

Similar papers

Open access Oct 2026

Coupled Bulk-Interfacial Modulation Enables Suppressed Conduction Loss in High-Temperature Polymer Capacitors.

Polymer film capacitors are widely used in electronic devices and power systems, yet their energy storage performance (ESP) deteriorates significantly under harsh operating conditions. Here, we propose a synergistic strategy that integrates bulk physical crosslinking with interfacial plasma regulation to suppress condu...

Tao Liu, Sen Ren, Yang Liu et al. · 0 citations
Open access Oct 2026

Synergistically Enhanced Properties of Polyimide Films via In-Situ Hollow SiO2 Nanospheres

Polyimide (PI) films serving as high-temperature dielectric and structural materials are increasingly required to combine mechanical robustness, thermal stability, and low dielectric properties for advanced electronic packaging. Herein, PI composite films incorporated with 110 nm hollow SiO2 nanospheres were fabricated...

Zheng Wu, Rui Meng, Chong-Gui Zhong et al. · 0 citations
Sep 2026

Silicon-Based Polyurea Composite Coatings with a Hydrogen Bond-Enhanced Network for Improved Mechanical Strength, Transparency, and Solvent Resistance

Polyurea materials have attracted considerable attention in fields such as protective coatings and elastomers due to their unique microphase-separated structure and dynamic hydrogen-bonding network. However, achieving high mechanical strength, excellent optical transparency, and environmental resistance simultaneousl...

Xiao-Ying Xin, Hao-Nan Nan, Shuang-Jie Wang et al. · 0 citations
Oct 2026

Interface Modification of Polyimide with Calcium-Based Hybrid Nanorods for Advanced Dielectrics

Polymers constitute vital dielectric media for energy-storage capacitors within contemporary electronic and electrical architectures. A persistent bottleneck in engineering high-energy-density polymer dielectrics lies in the concurrent optimization of dielectric constant and breakdown strength, two parameters traditi...

Zong-Yu Bai, Zhi-Xin Gao, Zhen Sun et al. · 0 citations
Open access Sep 2026

Synergistic Molecular Engineering and Crosslinking Topology for High‐Temperature Energy Storage in All‐Organic Dielectrics

This work presents an all‐organic polymer dielectric that combines high‐energy density with excellent high‐temperature endurance. To address the significant loss in polyetherimide (PEI) at high temperatures, a synergistic strategy is employed. This strategy involves the introduction of trifluoromethyl (CF 3 ) grou...

Xu Tong, Xue Zhang, Tian-Dong Zhang et al. · 0 citations
Review Open access Sep 2026

Carbon- and boron-based nano-inclusions for thermoelectric nanocomposites: Matrix matching and interface design

Summary Nanocomposite engineering offers a route to improve thermoelectric (TE) performance by modifying the coupled transport of charge carriers and phonons. This review examines carbon- and boron-based nanoinclusions across bismuth chalcogenides, Cu2Se, oxide matrices, and flexible polymer- and film-based thermoelect...

A. Ahmed, Yan-Nan Lu, Guang-Sai Yang et al. · 0 citations

We use cookies to run the site and, with your consent, for analytics and to show ads. See our Cookie Policy.